What PCB circuit board Plate

PCB circuit board consists of pads, vias, mounting holes, wires, components, connectors, filling, electrical boundary and other components, electronic products to meet the short, small, light, thin, high-density assembly requirements, to promote the circuit multi-layer board, super multi-layer development. PCB circuit board main role is to connect components to use, using a wide range of PCB board, small toys, cell phones, radios, large aviation, railways and other large-scale high-end electronic products. Here are some PCB circuit board sheet:

PCB board sheet has FR-1, FR-2, FR-3, FR-4, CEM-1, CEM-3. "FR" is representative of "flame retardant", FR-1, FR-2, CEM-1 and FR-3 are essentially the same, only a slight error on the mass, but not the three plates produced multilayer wiring board, and FR-4 and CEM-3 can be produced multilayer wiring board, FR-4 is the most common PCB boards, is the most widely used sheet, the current line MILL many are using this plate so the relatively low price of FR-4 sheet of some, but the FR-4 plate also has a heat resistance, highest withstand temperatures up to 130 degrees.

PCB circuit board copper is one of the most important components of PCB circuit board, PCB circuit board copper thickness 18um, 25um, 35um, 50um and 70um, international copper plate thickness is divided into three 35um, 50um and 70um if needed thick electroplated copper foil is required to use thicker or other chemical reactions of the circuit board copper foil thicker.

Common causes of poor design and SMB phenomenon Analysis

In the SMB design stage, if not fully take into account the manufacturing process requirements, resulting in the manufacturing process of the poor, to correct in the manufacturing process, there is a problem, it will waste hours delay period, they can not guarantee the quality of products; poor general design issues and, in production stage is difficult to overcome. Here are some common reasons for SMB design and produce undesirable phenomena.
1) Design of SMB no edge technology, process shaped hole or shape or size too big / too small, which is due to insufficient understanding of surface mount technology equipment, lead to the design of the SMB can not meet the requirements of the equipment setup, not mass production.
2) via the pad: when the result after the solder is melted by welding via the drain to the bottom, the solder joints is too small, welding unreliable. This is due to the designer of the reflow soldering process equipment enough to understand. SMT solder reflow soldering is distributed beforehand on the pad, solder melting connect components and PCB pad welding, when the PCB pad with a hole melted solder will flow through the lower hole, it is not a hole on the pad when the pad over the line must be drawn pad hole and then over the line.
3) chip component pad size asymmetry, especially land line, over the line as part of the pad to use, so that when the reflow chip components at both ends of uneven heating pads, solder melting has caused tombstoning.
Cause of the defect is part of the enterprise lack of a unified design specifications, good corporate design for manufacturing standard design is based on SMT process requirements, and the development of the enterprise status quo out of SMT equipment and continuous improvement.
Conclusion
Because of small surface mount components to meet the requirements of high density and automated assembly equipment, enabling miniaturization of electronic products, the volume, the development of a variety of functional requirements and accelerate the replacement frequency of reality, to promote the Surface Mount Technology unstoppable trends, design for manufacturability and therefore more and more integrated into the design of the PCB, which emphasizes the problems that may occur during the manufacturing process to advance to the design stage to resolve. Good PCB design for manufacturing can effectively control costs, shorten product development cycles, improve the market competitiveness of products.

Aluminum board process-B

5.4 board inspection
5.4.1 line surface must be in accordance with the requirements of the MI to check all the content.
5.4.2 must check on aluminum surface, aluminum surface dry film cannot have film falls and broken.
5.5 etching
5.5.1 for copper base is commonly 4 oz, will there is a certain difficulty in etching.First plate must be approved by the captain in person to do board, made in the spot check, line width, line spacing should be strengthened once every 10 PNL plate spot check line width, and make records.
5.5.2 recommended parameters: speed: 7 ~ 11 dm/min pressure: 2.5 kg/cm2 proportion: 25 be temperature: 55 ℃ (the above parameters are for reference only, the test plate results shall prevail)
5.5.3 back membrane should be paid attention to the time of the control between 4 ~ 6 min, because aluminium will reaction with NaOH, but also must ensure that the membrane clean, backing down membrane liquid membrane was not allowed to turn up the heat.No protective film of the plate, aluminum pcb, from liquid membrane in the back up after the board will not stay to wash water on a board in time of liquid membrane, prevent the alkali corrosion of aluminum surface.  
5.6 corrosion inspection
5.6.1 normal board.
5.6.2 it is forbidden to use the blade repair line, in order to avoid injury and dielectric layer.
5.7 the solder mask
5.7.1 production process:
Brush copper surface grinding plate (only) to screen printing green oil (the first), and preliminary drying screen printing green oil (second) and the preliminary drying - exposure and development - plate mill, the acid pickling process. Under the soft brush - after curing -
5.7.2 reference parameters:
5.7.2.1 yarn used 36 t + 100 t
First 75 ℃ 5.7.2.2 x 20-30 min;The second 75 ℃ x 20-30 min
5.7.2.3 exposure: 60/65 (single) 9 ~ 11
5.7.2.4 enhancement: speed: 1.6 ~ 1.8 m/min pressure: 3.0 kg/m2 (total pressure)
5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.   
5.8 HASL
5.8.1 spray before tin for aluminum plate with protective film tear protective film after spray tin.    
5.8.2 edge with both hands, it is strictly prohibited by hand directly touch the plate (especially aluminum surface).
5.8.3 operation, fight chafed.
5.8.4 tin cookie sheet before 130 ℃, 1 hour, and baking sheet to spray tin interval time less than 10 minutes.In order to avoid temperature difference cause a layered with ink.    
5.8.5 rework plate spray is only allowed to return once, if more than one board, to distinguish for special treatment.    
5.9 aluminum surface passivation treatment
5.9.1 level passivation process: (1) scrubbing brush (500 #) to (2) water - > (3) passivation, (4) washing the x 3-5. Dry - 6 drying
Note: (1) grinding plate: only aluminum surface grinding, FR4 parameter grinding plate.First board to check line no scratches, as well as the tin cried, uniform grinding crack.
(3)passivation: potion ingredients open cylinder quantity cylinder volume liquid temperature control concentration spraying in tank pressurization rate
Na2CO3 (CP) 50 g / 6500 g l, 130 l, 40 ~ 50 ℃ 2.0 ~ 3.0 1.0 ~ 1.5 m/min effective soaking time 10 ~ 15 s 100 m2 CP (K2CrO4) 15 g/l,  1950 g NaOH (CP) 390 g, 3 g/l
6 drying: 80 ~ 90 ℃.
Tyle = "the oledata.mso - spacerun: 'yes', the font size: 10.5000 pt; the font-family:" tahoma "; "> 5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.   
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.  

PCB Protype, MOQ 1PCS, Delivery time fastest 1day

   CNC drilling, cutting edge, light painting, etching production process, only for less demanding customers, providing fast, cheap proofing services. No drilling metal plating, no character screen (single layer PCB can be printed in black silkscreen ), solder green oil, only suitable for the experiment, manual welding, can also be used to check for errors before production. Because no drilling metal plating, double panel vias problem Check "vias solution", or modify files, avoiding component pins and vias, shop may be able to modify the file, because vias can resolve threading welded at both ends, but if the pin element and vias, there may be elements blocked welding end less, so to avoid component pins and vias; pad line to be set a little rough, welding is best to use low-temperature solder (shop for sale ). Recommended not to do, of course, if a lot of your money, we do not oppose the demanding user is recommended to do the whole process. 16:30 hours before delivery traded at 22:00, 16:30, if the transaction had to be postponed until 22:00 the next day will delivery. Do not take different type in a panel.

Technical indicators are as follows:
Layers (maximum) 1-30
Panel type FR-4
The maximum size of 500mm X1100mm
Accuracy ± 0.2mm Dimensions
Thickness range of 0.40mm - 2.4mm
Thickness tolerances (t ≥ 0.8mm) ± 10%
Thickness tolerances (t <0.8mm) ± 10%
Media thickness 0.075mm - 5.00mm
The minimum width 6mil
Minimum spacing 6mil
35um thick outer layer of copper
Inner copper thickness 17um - 100um
Drilling aperture (ROP) 0.3mm - 6.35mm
Into the hole diameter (drilling) 0.3mm - 6.30mm
Diameter tolerance (ROP) 0.08mm
Diameter tolerance (ROP) 0.09mm
Thickness aperture ratio 8: 1
Solder type photographic ink
The minimum width of 0.1mm solder bridge

Sophie Deng
_______________________________________
Wonderful PCB Limited
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Welcome to our trading shows:
1.Booth: L32,Expo Electronic 2013,Apr.10-12th in CROCUS EXPO,Moscow,Russia
2.Booth: 11J36, HK Global sources  Apr.12-15th, 2013 Asia World-Expo, Hong Kong
3.Booth: 9J35, HK Global sources Oct.12-15th,2013 Asia World-Expo, Hong Kong
4.Booth: 70206, CES  2014  Jan,8th-11th in Las Vegas, USA

My four personal favorite avenues for finding parts are

Mouser.com – Mouser is a popular worldwide component distributor that has a wide range of products. Their selection is (in my experience) not quite as large as Digi-Key’s, but I prefer their website design, the better filtering system, and the more logical component organization.
DigiKey.com – Digi-Key is another popular worldwide component distributor. They probably have the largest component selection of any distributor, have great customer service, and are fast to ship. Overall I would put Mouser and Digi-Key about even, and certainly at the top of the list.
Octopart.com – This is a relatively new service that is like Google for electronics. Octopart searches through many different distributor channels for the part you want. There are many things I like about this service. They always put the datasheet in an easy to find spot, they provide a useful product summary, and show you price comparisons from different distributors. But there are drawbacks, Octopart still seems a bit unrefined and I don’t think it is worthwhile to compare prices from different distributors unless you are only buying a single part or are buying a massive quantity of components and shipping costs are negligible. In a few years Octopart may become the standard for finding your parts, but for now it still has some room to grow.
datasheets360.com – Datasheets360 has a database of over 70 million electronic components, each with a PDF datasheet and is working on scaling the site up to 350 million parts (up to about 180 million in November 2013).  In addition to datasheets they also provide inventory and pricing information from some of the major suppliers. This is a great resource.
This is just my preference, do you have a better method of finding parts? Let me know in the comments below.
Following will be continued in next chapter.
Shirley Xia
Wonderful PCB
T +86-755-86229518-636
e  wonderful25@wonderfulpcb.com |
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Multilayer PCB design method (X)

11.4.2 The electrical Multilayer pcb segmentation method
(2) Click the Add button, the pop-up as shown in figure 11 to 15 electric layer segmentation in Settings dialog.

As shown in figure 11 to 15 in the dialog, Track Width used to set the drawing border line Width, but also in the electric network within the same region between the insulation of the spacing, so usually will Track Width is larger. Suggest that readers will input unit when the input value. If only enter the Numbers in the film, not the input unit, the system will default to the current PCB units in the editor.

Within segmentation of the specified Layer option is used to set electric Layer, here can choose electric power & GND inside Layer. In this case, there are many kinds of voltage grade, so you need to split the Power within the electrical layer to provide different levels of voltage components.

Connect to the.net option is used to specify the divided region is connected network. Usually in electric layer is used for power supply and network layout, but in the Connect to net the drop-down list as you can see, the inner layer of the whole network can be connected to the network signal, used in signal transmission, don't just general designer. Weak signals required by the voltage and current, small requirement to the wire, and power supply current is big, need a smaller equivalent internal resistance.So general signal in signal layer line, dedicated to the power supply and electrical layer network connections.

Ms Grace Zhang
________________________________
Oversea sales
Wonderful PCB
A Floor 6, Nanyuan Fengye Mansion, Nanshan Avenue, Nanshan District, Shenzhen City 518054, China

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