2015年4月22日星期三

PCB Industry

At present, Chinese production of electronic circuits, and printed circuit industry sales accounted for 44 percent of the global total; China printed circuit board equipment, raw materials, sales and production also remain the world's first. Despite the good momentum of development, many exhibitors participating CPCASHOW has said that due to the recent influx of a large number of PCB industry areas, capacity expansion is serious, resulting in a vicious competition intensified. In addition, the continued growth of smart terminals and emerging markets, driven by significantly increasing the demand for HDI, FPC, etc., but also stimulate the industry investment to expand plant expansion, further intensified price competition.

I found that many domestic exhibitors showcasing high-order HDI, IC, buried blind PCB, FPC, high-end products, such as multi-layer pcb board, PCB manufacturers have indicated that many domestic with international advanced manufacturing PCB comparable.

Production capacity expansion, high degree of product homogeneity, leading PCB price pressures. Price war intensified, most industry struggling to cope.

How to deal with a price war? I found a positive innovation in the field show exhibitors are booming popularity. Visible on the product technology upgrades, technological innovation will help blaze a new trail in the price war. In addition, to improve product competitiveness, increase product functionality and value, so that enterprises break free from the mire of product homogeneity, but also to important initiatives.

When it is time for finding a manufacturer, consider manufacturers in Shenzhen, China. They have done offering these kinds of services professionally for years. You want some good companies to be recommended? WONDERFUL PCB LIMITED is not a bad choice.

If you need expert PCB assembly service, feel free to contact wonderful02@wonderfulpcb.com.

2015年4月14日星期二

Vias

The final “main component” of a PCB would be the ever useful via. Vias are used in multi-layer boards to electrically connect one layer to another.
There are essentially three types of vias, only one of which is common in the hobbyist world. These via types are:
Through hole - Most common type of via, a hole is drilled through the whole board and then electroplated so that it is conductive.
Blind - A blind via is used in designs with more than two layers to connect a surface layer to an internal layer without going all the way through.
Buried - Buried vias are similar to blind vias but are only used to connect internal layers.

Following will be continued in next chapter.

Shirley Xia
Oversea sales
Wonderful PCB

 A Floor 6, Nanyuan Fengye Mansion, Nanshan Avenue, Nanshan District, Shenzhen City 518054, China.
T +86-755-86229518-821 / Cell phone and whatsApp:008613480796172
F  +86 755 2607 3529|
e  wonderful25@wonderfulpcb.com |
w  www.wonderfulpcb.com  | Skype:wonderful-pcb02
Welcome to our trading shows:
Booth: 9G27, HK Globalsources Oct.11-14th,2014 AsiaWorld-Expo, Hongkong
Booth:A3.274-1,2014.11.11-2014.11.14,the Electronica in Munich, Germany

2015年4月13日星期一

FPC for LED Application

LED is more and more popular in ordinary family. As we all know, the key part of LED light is printed circuit board. For LED PCB, we usually use metal core material like Aluminum to make circuit on it. As the development of society and diversification of demands, recently more and more people pay attention on the Flexible circuit with LED (or said LED Flexible circuit). Along with the FPC industry growing, as well as the LED application spread out, there’s continuing request of precision lighting & illumination in some special circumstance.

Flexible circuitry is the thinnest available in interconnection technology. The thickness of the dielectric film typically ranges from 7.5 to 125 mm (0.3 to 5 mils) with line widths and spacing as low as 1 mil. As a comparison, standard ribbon cables have minimum line spacing of about 25 mils, with 50 mils being the norm. This wide spacing can be attributed to the fact that ribbon cable typically uses a PVC insulator that is much thicker and heavier than the polymer dielectric film used in flexible PCB board. Additionally, ribbon cable requires mechanical connectors for termination and cannot be used as an assembly medium.
Therefore, in many applications where space and weight is a premium, flex is the only option

In fact, this Flexible circuit with LED is a special single sided FPC or two layers FPC, with adhesive tape at the bottom side, easy peel off and installation. The outstanding characteristic is its length. Theoretically, the length of this Flexible circuit can be made according to clients’ request.

Here we’d like to talk about some features of Flexible Circuits with LED & LED Flexible Circuits

1) Separable SMD/SMT LED strip on Flexible circuit boards can be bended to the tour of any products with self adhesive tape back, easy installation! They are mounted on self-adhesive tape and can be conveniently field-cut. For adhesive tape, normally we use 3M 467/946/966, or as per request.

2) As long as the clients request (strip-to-strip soldered connecting). You can also choose our extreme long FPC which is 9.8 feet (3m) without soldering.

3) This flex circuit modules, after LED SMT/SMD were done, are ideal for edge lighting transparent and diffuse material. They provide an optimal solution for precise backlighting of complex contours. They can also be used of lifesaving/rescue sign lights and commercial signs and for making contours like escape routes, borders and stairs.

4) Customer design LED location, quantity, color (red, green, blue, true green, white (phosphor on blue), yellow, etc), according to the request of luminous intensity & color.

5) Flexible circuit boards (FPC) surface in white finish, with classic looking, or as per request

6). With IC constant current circuits, guarantee stable working current and even light output for the whole reel of lights.

(7) Thermal and Mechanical Characteristics
Flexible circuits commonly pass through different electrical, thermal, and mechanical environments. For example, the basic disk drive circuit moves back and forth millions of time over a rotating platter. Electrically, the flexible printed circuit compromises its signal integrity each time a trace carrying a signal is moved with respect to the surrounding electrical environment. Thermally, the circuit is exposed to the heat generated within the disk drive enclosure. Mechanically, the circuit works like a spring, either resisting or adding force to the mechanical movement. The design engineer must consider if the electrical problems will overshadow the mechanical problems or if the thermal problems will become the most dominant. All of these considerations can be discussed with a flexible printed circuit manufacturer to arrive at the best solution.

If you need any help or PCB or FPC prototype, please don’t hesitate to contact Wonderful PCB Technology Co., LTD. for more information about Flexible Circuits with LED (LED Flexible circuit boards). We are always to be your best partner of FPC in Asia.

2015年4月6日星期一

PCB copy board concrete steps

The first step is to get a piece of PCB, first in the paper to record all elements of the model, parameters, as well as the location, especially the diode, the direction of the triple tube, the direction of the IC gap.It is better to digital camera two pictures from a location.Now the PCB more do more advanced the diode triode, some do not pay attention to don't see above.

The second step, tear down all laminated copy board, the tin in the PAD holes and be removed.PCB clean with alcohol, and then put into the scanner, the scanner to scan when need somewhat higher scan pixels, in order to get a clear image.Yarn paper will top and bottom with water slightly grinding, polishing to copper film, into the scanner, start PHOTOSHOP, knocked two layers respectively into in color mode.Note that the PCB must be horizontal even vertical, put in the scanner or scanning image is unusable.

The third step, adjust the contrast of the canvas, the contrast, the copper film part of and not part of the copper film contrast, then the first figure to black and white, check whether the line is clear, if not clear, repeat this step.If clear, will survive for the black and white TOP. The BMP file format of BMP and BOT. BMP, if found problems graphics can also repair and correction in PHOTOSHOP

The fourth step, the two BMP format into PROTEL format file, respectively in PROTEL transfer into two layers, such as a two layer of the PAD and the location of the VIA basic coincidence, that several steps before doing very well, if there is a deviation, then repeat step 3.So PCB copy board is a very need patience work, because a little problem will affect the quality and copy the board after the match.

Fifth, TOP. The TOP layer of BMP can be converted to PCB, be careful to into a SILK layer, the layer is yellow, then you are in the TOP layer is tracing, and drawing device according to the second step.After the draw will delete the SILK layer.Repeated know to draw all the layers.

Step 6, TOP in PROTEL PCB and BOT. PCB paged, into a graph with respect to OK.

Step 7, the TOPLAYER with laser printers, BOTTOMLAYER respectively printed on transparent film (1:1 ratio), put the film on the PCB, compare the errors, if yes, you're done.

A and the original plate the same copy board was born, but it is only half done.Test, test copy plate electronic technology performance is same as the original plate.If it is completed. Note: if it is a multilayer and careful polishing to the lining of the inside, at the same time, repeat steps, the third to the fifth copy board graphic name is different, of course, want to be decided according to the number of layers, the general double panel is much simpler than a multilayer copy board, multilayer copy plate prone to alignment, so profes sional copy board look and careful (including internal guide hole and guide hole is not easy to appear problem).

For more information, pls kindly contact me: wonderful11@wonderfulpcb.com

2015年4月2日星期四

Aluminum board process-B

5.4 board inspection
5.4.1 line surface must be in accordance with the requirements of the MI to check all the content.
5.4.2 must check on aluminum pcb surface, aluminum surface dry film cannot have film falls and broken.
5.5 etching
5.5.1 for copper base is commonly 4 oz, will there is a certain difficulty in etching.First plate must be approved by the captain in person to do board, made in the spot check, line width, line spacing should be strengthened once every 10 PNL plate spot check line width, and make records.
5.5.2 recommended parameters: speed: 7 ~ 11 dm/min pressure: 2.5 kg/cm2 proportion: 25 be temperature: 55 ℃ (the above parameters are for reference only, the test plate results shall prevail)
5.5.3 back membrane should be paid attention to the time of the control between 4 ~ 6 min, because aluminium will reaction with NaOH, but also must ensure that the membrane clean, backing down membrane liquid membrane was not allowed to turn up the heat.No protective film of the plate, aluminum, from liquid membrane in the back up after the board will not stay to wash water on a board in time of liquid membrane, prevent the alkali corrosion of aluminum surface.  
5.6 corrosion inspection
5.6.1 normal board.
5.6.2 it is forbidden to use the blade repair line, in order to avoid injury and dielectric layer.
5.7 the solder mask
5.7.1 production process:
Brush copper surface grinding plate (only) to screen printing green oil (the first), and preliminary drying screen printing green oil (second) and the preliminary drying - exposure and development - plate mill, the acid pickling process. Under the soft brush - after curing -
5.7.2 reference parameters:
5.7.2.1 yarn used 36 t + 100 t
First 75 ℃ 5.7.2.2 x 20-30 min;The second 75 ℃ x 20-30 min
5.7.2.3 exposure: 60/65 (single) 9 ~ 11
5.7.2.4 enhancement: speed: 1.6 ~ 1.8 m/min pressure: 3.0 kg/m2 (total pressure)
5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.   
5.8 HASL
5.8.1 spray before tin for aluminum plate with protective film tear protective film after spray tin.    
5.8.2 edge with both hands, it is strictly prohibited by hand directly touch the plate (especially aluminum surface).
5.8.3 operation, fight chafed.
5.8.4 tin cookie sheet before 130 ℃, 1 hour, and baking sheet to spray tin interval time less than 10 minutes.In order to avoid temperature difference cause a layered with ink.    
5.8.5 rework plate spray is only allowed to return once, if more than one board, to distinguish for special treatment.    
5.9 aluminum surface passivation treatment
5.9.1 level passivation process: (1) scrubbing brush (500 #) to (2) water - > (3) passivation, (4) washing the x 3-5. Dry - 6 drying
Note: (1) grinding plate: only aluminum surface grinding, FR4 parameter grinding plate.First board to check line no scratches, as well as the tin cried, uniform grinding crack.
(3)passivation: potion ingredients open cylinder quantity cylinder volume liquid temperature control concentration spraying in tank pressurization rate
Na2CO3 (CP) 50 g / 6500 g l, 130 l, 40 ~ 50 ℃ 2.0 ~ 3.0 1.0 ~ 1.5 m/min effective soaking time 10 ~ 15 s 100 m2 CP (K2CrO4) 15 g/l,  1950 g NaOH (CP) 390 g, 3 g/l
6 drying: 80 ~ 90 ℃.
Tyle = "the oledata.mso - spacerun: 'yes', the font size: 10.5000 pt; the font-family:" tahoma "; "> 5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.   
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.  

2015年4月1日星期三

FPC assembly Pallets features

I would like to introduce the comparison between Magnetic reflow pallets and silica gel plate.

A. Stability: magnetic reflow pallet in magnetic state to even out the FPC, as the physical process, magnetic may increase or decrease according to request, don't change due to factors such as temperature, time, relatively stable.Silica gel plate adopt chemistry, will change under different temperature or Time or other condition, which lack of stability. Especially in the use of a certain period of time after a drop in viscosity, and not clean viscosity decreased during us, which cause FPC substrate deformation while crossing the reflow soldering and affect the welding quality.

B. Usage Life: magnetic reflow tray used in magnetic material and working principle of physical process, are high temperature resistant material,
As long as it's not  destroyed by man or at accident situation, it can be permanent online.  state can use permanent damage and accidents.Silica gel plate in use process, USES the chemical process,In use process, it will be aging of due to silicone materials, including Japan's material, no more than 1000 times return.The cost is very high.

C. Quality: magnetic reflow pallet at work on FPC insulating protection at the same time, FPC won’ t be destroyed when workman pick up the FPC.Silica gel plate in use process to ensure the smooth of FPC, has certain viscosity,and will stick to FPC, which will be difficulty for picking up FPC and may cause FPC deformation.

1.Comparison between Magnetic reflow pallets and normal plate

A.Quality: magnetic reflow pallet, because of FPC flat surface cause from the steel, reflow soldering will be reduced during FPC flow, which can guarantee the stability of welding quality, reduce adverse.Ordinary tray can only be used with high temperature tape around the FPC, after reflow soldering
, which easy to cause deformation to the middle part of FPC, tin water to overflow, cause bad welding, which will affect the quality. At the same time, magnetic
Reflow soldering tray can reduce some difficulty, like can avoid the high temperature stick to FPC lead to hard FPC being picked up or FPC deformation.

B. Cost: magnetic reflow soldering tray, convenient to use,  reduce prework workers, and the person to take off the tape after reflow soldering, at meanwhile, can reduce the use amount of the high temperature tape. Investment is bigger at first time to magnetic reflow soldering tray, however, it has cost advantage for mass production.

PCB copy board process

Below illustrates the whole process of copy board:
If there is a 4 layer board, components are removed, clean surface, we want to copy it into the Multilayer pcb file, according to the following steps:
 
1, scan the top plate, save images, name is top. BMP, then set the scan DPI can be set according to different density, if set is 400 DPI.   

2, scanning the bottom plate, save images, name for bottom. BMP

3, the middle tier 1 with sandpaper grind, leakage of copper sheet, clean after scans, name for mid1. BMP

4, the middle tier 2 with sandpaper grind, leakage of copper sheet, clean after scans, name for mid2. BMP

 5, each image in the PHOTOSHOP level (selected pictures, guarantee the images into a level, it will look out of the line, and picture more easily and alignment), it suggested that the underlying figure do level image, make the system diagram is in the same direction, up and down the positioning hole.Note do not need to cut out the picture just in here, had better leave some rich, almost as long as the picture just a matter of the level.   

6, open the color copy board software, from the main menu "file" - > "open the BMP file, choose top. BMP file to open.

After 7, set DPI, can copy the top figure, choose the first layer to the top, and then began to put components, via, wires, etc.   

8, after the top put all things, save temporary files (instruction and help, it is through the menu or toolbar button on yourself to choose), name of top - 1. The DPB (among different time save the name suggest a number of names, such as top - 1. The DPB, top - 2. DPB, so avoid computer failure, destroyed the last file, but can also save a version of the file, reduce the loss, this is a proposal, see the personal interests).

9, close the current picture window (note that a can only open a picture, don't open multiple images).   

10, from the main menu "file" - > "open the BMP file", choose the underlying figure bottom. BMP, temporary files and then open the top - 1. The DPB, then find the top draw good figure and the underlying background is not aligned, press Ctrl + A key combination, put all the good figure yuan is selected, press on the keyboard up, down, left and right cursor keys or number keys 2, 4, 6, 8 whole mobile, choose several reference points and the corresponding point on the background, then you can choose the current layer to the bottom, A walk is the bottom line, welding plate, filling, etc., if the top is blocking the line of the bottom, how to do?Is very simple, but from the main menu select "options" "layer color Settings", it is ok to check points off the top, also the top screen printing can also be closed.After copying the underlying, save the temporary file for bottom - 1. The DPB, or save the PCB files for bottom - 1. The PCB, then the file is already a file alignment, combination of two layers.   

11, a process is the same as the middle layer copy board, repeat steps 9 ~ 10, the final output of the PCB file, is four layers together and objects of the same PCB figure.  

Color copy board software some shortcuts and PROTEL is same, can see software to help or instruction in the list of "shortcuts".  
In a word, software use basically does not need too much learning can get started.